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Overview

Signal integrity (SI) analysis helps ensure reliable high-speed digital and analog signal transmission. KiCad provides tools for transmission line modeling, impedance control, and IBIS-based simulation.

Transmission Line Theory

Characteristic Impedance

For a PCB trace, the characteristic impedance Z₀ is determined by:
Where:
  • L = inductance per unit length
  • C = capacitance per unit length

Microstrip Traces

Surface traces with ground plane beneath:
Where:
  • εᵣ = dielectric constant
  • h = height above ground plane
  • w = trace width
  • t = trace thickness

Stripline Traces

Internal traces between ground planes:

Stackup Configuration

Define board stackup in the board file (.kicad_pcb):

Impedance Calculator

Use KiCad’s built-in PCB Calculator for impedance:

Differential Pairs

Coupling and Impedance

For differential pairs:
Where k is the coupling coefficient.

Design Rules

Set up differential pair rules in PCB:

IBIS Models

KiCad supports IBIS (I/O Buffer Information Specification) models for signal integrity simulation.

IBIS File Structure

Loading IBIS Models

Programmatic access to IBIS models:

Reflection Analysis

Reflection Coefficient

Where:
  • Z_L = load impedance
  • Z₀ = transmission line impedance

Return Loss

Good design targets:
  • RL > 10 dB (acceptable)
  • RL > 20 dB (good)
  • RL > 30 dB (excellent)

Python Analysis

Crosstalk Analysis

Near-End and Far-End Crosstalk

Propagation Delay

Delay Calculation

Design Guidelines

High-Speed Design Rules

Impedance Tolerances

  • Single-ended: ±10% (45-55Ω for 50Ω target)
  • Differential: ±10% (90-110Ω for 100Ω target)
  • Tight control: ±5% for critical signals

Practical Examples

DDR4 Interface

PCIe Gen3

Via Modeling

Via Impedance Discontinuity

Best Practices

  1. Minimize via stubs: Use back-drilling for high-speed signals
  2. Control impedance: Maintain ±10% throughout signal path
  3. Match lengths: Keep clock/data skew within specifications
  4. Avoid splits: Don’t cross reference plane gaps
  5. Use ground stitching: Place vias near signal transitions
  6. Simulate critical nets: Verify timing and integrity before fabrication
  7. Document stackup: Specify impedance requirements to fabricator

See Also